Electronics Assembly Quality Engineer

About the Role

micro1 is engaging Electronics Assembly Quality Engineers to contribute their expertise on a customer project focused on electronics manufacturing quality and reliability. In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters. This opportunity is suited to process and quality engineering professionals with hands-on experience in reviewing X-ray images of area-array solder joints (BGA, CGA, LGA), analyzing solder defects, optimizing reflow processes, and laboratory specialists skilled in counterfeit electronic component screening. Cases span voiding, head-in-pillow, bridging, open joints, reflow profile adjustments, Class 3 acceptance, and component authenticity detection. Contributors may have strengths on either process quality or counterfeit analysis—please indicate your focus.

Responsibilities & Tasks

• Analyze and interpret X-ray images of BGA, CGA, and LGA solder joints, identifying defects such as voiding, head-in-pillow, bridging, and opens.
• Review and suggest improvements to reflow soldering profiles to address process-related solder defects.
• Provide detailed root cause analysis and recommendations for solder joint anomalies and reliability concerns.
• Assess real-world cases for IPC Class 3 acceptance, documenting critical observations and decision criteria.
• Evaluate and outline test laboratory flows for counterfeit electronic component detection and screening.
• Deliver comprehensive written and verbal summaries of findings, ensuring clarity and actionable guidance.
• Contribute technical insights that enhance AI training data quality in the field of electronics assembly and component validation.

Qualifications & Requirements

• Extensive hands-on experience in electronics manufacturing process or quality engineering, particularly with area-array packages.
• Advanced proficiency in interpreting X-ray images and diagnosing solder joint failures.
• Strong expertise in reflow soldering process optimization and process troubleshooting.
• Familiarity with IPC acceptance standards, especially Class 3 requirements for critical applications.
• Experience with counterfeit component detection test methodologies and laboratory practices in component authentication.
• Exceptional written and verbal communication skills for technical documentation and cross-functional knowledge sharing.
• Background as either a process engineer, quality engineer, or laboratory analyst in electronics assembly or component screening (specify your strength area).

Eligibility